A convenient blind-mateable solution specifically for ultra-high-power applications, our XMP series combines our design expertise in push-on connectors with application-specific materials to achieve high power handling capability at RF frequencies.
The pre-tinned surfaces of these SMP & SMPM PCB-mount connectors prevent corrosion and oxidization while increasing solder joint reliability. The embossed feature allows gases to escape from under the connector body, preventing the “popcorn effect” commonly associated with the high heat applied during the wave solder process.
Comparable in size to an SMA connector, and with similar power handling capability and durability in a push-on configuration, our TMP series is a convenient blind-mateable solution specifically for high-power applications.
High-performance compression mount multi-port interconnect system with both 2.5 mm and 4 mm spacing pitch. Designed for demanding bandwidths up to 65 GHz. Standard products are available in single-, 2-, 4-, 6-, 8-, and 10-channel configurations.