Available contact and connector systems: 1) High reliability contact system featuring 3 points of contact. Available in SMT, Paste in Hole, and Printed Through Hole termination styles. 2) connector without metal shell, 3) connector with metal shell.
Carlisle Interconnect Technologies (CarlisleIT) AltaVel™ family of open pin field High-Speed Digital Interconnect is optimized to provide scalability and reliability in dense, high-mate/de-mate cycles applications greater than 25Gbps. The broad family of connectors are available in the following configurations: Board to Board, Board to Cable, Cable to Cable and Cable to Panel. All configurations are available in the following styles: Vertical to Vertical, Right Angle to Vertical and Right Angle to Right Angle. These standard connectors are part of CarlisleIT’s full lineup of cost-effective, off-the-shelf and customizable interconnect solutions delivering superior signal integrity performance and value.
| Feature | Customer Benefit |
|---|---|
| 10,000 mate/de-mate cycles | High signal integrity and reliability in a long-life package ensures high performance and lower cost of ownership |
| Flexible, scalable design | High density, scalable design provides multiple configurations, enabling optimum performance at the lowest total cost. Size ranges from 10 to 200 pins; configurable in 1 to 4 rows by 10, 20, 30, 40, or 50 positions. Configurable by Pin/Spacer height, 8mm, 12mm, 16mm, and 20mm. |
| With or without metal shells | Rugged/EMI housing option is a readily available option for applications used in extreme environments |
| Open pin field design | Design allows for flexibility in routing and coding schemes, including single-ended, differential pair, power, ground, and sideband signals |
| Impedance: Differential – 85 and 100 ohm Single-ended – 50 and 75 ohm | Multiple impedance options ensure a solution to meet your application |
|
Board mounting options |
Termination style options: Surface Mount (SMT), Paste In Hole (PIH), and Through Hole (PTH) |
| Parameter | Specifications |
|---|---|
| Insertion Loss | <0.8 dB to 25 Ghz (interconnect only)* |
| Data Rate | FDR – 14 Gbps, EDR – 28 Gbps & PCIe Gen4 – 16 Gbps, PCIe Gen5- 32Gbps |
| Impedance | 85 or 100 ohm differential impedance; 50 or 75 ohm single-ended impedance |
| Contact rating | 3 amp max, at ambient with 30° rise |
| Operating Temperature | -55C to +125C |
| Minimum Contact Wipe | 1 mm (0.039″) typical |
| Contact Mating Force | 40 grams typical |
| Insulation Resistance | 5,000 megaohms minimum @ 500 VDC |
| DC Resistance (mated pair) | 8.5 milliohm @ 8mm stack height |
| Durability | min 1,000 cycles and up to 10,000 mate/demate cycles |
| Sinusoidal Vibration | 20g (EIA-364-28, condition IV) |
| Shock | 50 g (EIA-364-27, condition E) |
| Operating Voltage | 200 V, RMS, 60 Hz typical |
*Simulated data only
| Pin Contacts | BeCu per ASTM B194, plated 30–50 μin gold over 100 μin nickel minimum in mated contact area, 5 μin gold over 100 μin nickel on tails |
|---|---|
| Socket Contacts | BeCu per ASTM B194, plated 30 – 50 µin gold over 100 nickel minimum in mated contact area, 5 gold over 100 µ nickel on tails |
| Contact Finish | Localized gold finish per ASTM B488 over nickel per ASTM B689 Type 1 |
| Molded Insulators | 30% glass-filled LCP per ASTM D5138 |
| Hardware | Stainless steel |
| Shell (ruggedized) | Aluminum alloy |
| Finish (ruggedized) | Nickel plated |
| RoHS Compliant | Yes |
| Solderable | Lead or lead-free |
AltaVel™ product information sheet
To inquire about AltaVel™ available from CarlisleIT, please fill out the form below, and one of our Sales Engineers will contact
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