Carlisle Interconnect Technologies' (CarlisleIT) AltaVel family of open pin field High Speed Digital (>25 Gbps) Interconnect is optimized to provide scalability and reliability in dense, high mate/de-mate cycles applications. The broad family of connectors are available in the following configurations; Board to Board, Board to Cable, Cable to Cable and Cable to Panel. All configurations are available in the following styles; Vertical to Vertical, Right Angle to Vertical and Right Angle to Right Angle. These standard connectors are part of CarlisleIT's full lineup of cost effective, off the shelf and customizable interconnect solutions delivering superior signal integrity performance and value. This product available 1Q 2019.
High speed digital boards and systems
High speed digital HW and system verification
Network systems
Servers & storage – blade and rack mount
Switches
Routers
Optical transport carrier grade optical
Wireless infrastructure
Download the CarlisleIT AltaVel Product Overview (.pdf)
| Feature | Customer Benefit |
|---|---|
| 10,000 mate/de-mate cycles | High signal integrity and reliability in a long life package ensures high performance and lower cost of ownership |
| Flexible, scalable design | High capacity design provides multiple configurations, enabling optimum performance at lowest total cost Size ranges from 40 to 200 pins; configurable in 4 rows by 10, 20, 30, 40 or 50 columns |
| With or without metal shells | Rugged/EMI housing option is a readily available option for applications used in extreme environments |
| Open pin field design | Design allows for flexibility in routing and coding schemes, including: single-ended, differential pair, power, ground, and sideband signals |
| Impedance: Differential - 85 and 100 ohm Single ended - 50 and 75 ohm |
Multiple impedance options ensures a solution to meet your application |
Contact system (1), board-to-board with metal shell (2), and without metal shell (3) available
| Parameter | Specifications |
|---|---|
| Insertion Loss | <0.8 dB to 25Ghz (interconnect only)* |
| Data Rate | FDR - 14Gb/s, EDR - 26Gb/s & PCIe Gen4 - 16Gb/s |
| Impedance | 85 or 100 ohm differential impedance; 50 or 75 ohm single-ended impedance |
| Contact rating | 3 amp max, at ambient with 30° rise |
| Operating Temperature | -55˚C to +125˚C |
| Minimum Contact Wipe | 1 mm (0.039") typical |
| Contact Mating Force | 40 grams typical |
| Insulation Resistance | 5,000 megaohms minimum @ 500 VDC |
| DC Resistance (mated pair) | 8.5 milliohm @ 8mm stack height |
| Durability | min 1,000 cycles and up to 10,000 mate/demate cycles |
| Sinusoidal Vibration | 20g (EIA-364-28, condition IV) |
| Shock | 50 g (EIA-364-27, condition E) |
| Operating Voltage | 200 V, RMS, 60 Hz typical |
| Materials & Finishes | |
|---|---|
| Pin Contacts | BeCu per ASTM B194, plated 30 - 50 μin gold over100 μin nickel minimum in mated contact area, 5 μin gold over 100 μin nickel on tailsp |
| Socket Contacts | BeCu per ASTM B194, plated 30 - 50 μin gold over100 μin nickel minimum in mated contact area, 5μin gold over 100 μin nickel on tails |
| Contact Finish | Localized gold finish per ASTM B488 over nickel per ASTM B689 Type 1 |
| Molded Insulators | 30% glass-filled LCP per ASTM D5138 |
| Hardware | Stainless steel |
| Shell (ruggedized) | Aluminum alloy |
| Finish (ruggedized) | Nickel plated |
| RoHS Compliant: | Yes |
| Solderable: | Lead or lead-free |
For more information on CarlisleIT Test and Measurement solutions, contact Beth Curtis at (+1) 425-656-5658.
Off the shelf or fully customized, CarlisleIT connects you with what your business needs to succeed.
