Thermal Management Solution (TMS)

Functional and flexible design to support the cooling and installation requirements of any system

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Installation concept and initial technology development based on business/regional/vip jet application in the typical L-band High Gain Antenna footprint. Approx. 16”x45”. Design is scalable for commercial aircraft installation in an ARINC791 or 792 compliant configuration.


Focus on lowest possible profile radome. Radome component could even be integrated into antenna structure and removed from the installation package. Scaled down from proposed commercial ESA antenna size.


Cooling airflow modeling and simulation performed to optimize cooling performance. Venting design based on streamline capture principle avoiding ram-air pressure and utilizing pressure differential. Low profile system operating at or near boundary layer minimizes effects of lift and drag. Flexibility of design to size and locate venting to optimize specific system cooling requirements.

Thermal Management Solution

Integrated isothermal transfer plate utilizes patented technology to transfer heat from the antenna(s). Passive elements reject heat to surrounding environment. All aluminum structure eliminates concerns about galvanic corrosion common to other heat transfer technologies. Thermal Management Solution can be adapted to any antenna form factor and integrated into antenna support structure.

Interface to Aircraft

ESA installation concept uses standard hardware developed for L-band antenna installation. ARINC791 or 792 packages would utilize CarlisleIT’s patented low-profile fittings for flush mounting of antenna and minimal overall installation height. Provisions for power, data and RF can be configured as needed by system.

Sealing and Protection of Antenna

Screened inlets prevent debris ingress. Airflow path segregated from the payload for protection from contaminants – FOD, de-icing fluid and moisture.


Use of passive components results in maximum reliability. Modular design allows for repair, upgrade and replacement at sub-component level.

Incorporation of Other Cooling Technologies

System flexibility to augment cooling performance for higher power consumption, including incorporation of cooling fans.

More Information

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