High Density RF Interconnect (HDRFI®)
HDRFI® is a patented Carlisle Interconnect Technologies connection
system that transfers high frequency signals through a unique planar
interface. This planar interface removes the need for typical pin and
socket connections by utilizing a z-axis elastomer to provide the
electrical path between the mated connectors. The elastomer is made up
of silicone, impregnated with gold plated stainless steel wires and is
arranged on a .035mm pitch. When compressed by the mating halves, the
gold plated wires mechanically connect the two planar surfaces and
creates an electrical EMI barrier to provide excellent isolation.
HDRFI® is available only as an assembly in three product line
offerings: D-Sub, RF Circular and custom applications. The assemblies
can be used with a 26AWG coax for internal applications or 24AWG for
external requirements. Consult factory for more information.
Features and Benefits:
- High Bandwidth
- High Density
- Small Form Factor
- Center to Center spacing 0.130"
- Eliminates Stubbing
- Alignment of the connector is not made through the RF path
- Can be used differentially or single ended